A Wide range of conductive pastes for various applications are available from csc.
Some of CSC's typical paste productions are as follows:

- Termination pastes for pzt devise, varistors, 
   - PTC  thermistors, NTCthermistors, and ceramic /
  Ta capacitors.		 - Polymer based materials for membrane
   switches, interconnections, coatings,
   adhesives, sealants.
- Internal electrode inks for MLCC,  varistors, and
   - PTC thermistors, NTC   thermistor.		 -  Automotive glass products, conductors,
    ceramic colours, etc.
- Conductor pastes for ceramic substrates
   and sensor		 - Overglaze productions
-  Dielectric pastes

All pastes are made in accrodance with strict quality control standards from raw material preparations
to final testings. In addition CSC keenly recognizes the need to set customized specifications through
technical cooperations with customers, and is willing to provide whatever flexibilities the customers need
for innovative design and production.

  Productions available from CSC

- Pastes for Membrane Touch Switches
- Pastes for Silver Through-Hole

- Pastes for Slide Volumes
- Pastes for PTC Thermistors
- Pastes for NTC Thermistors

- Pastes for Varistors

- Pastes for Piezo-Electric Products

- Pastes for Microwave Products
- Pastes for Ceramic Disc Capacitors

- Pastes for Hybrid ICs

◆ Pastes for Membrane Touch Switches  

  Product No.   Composition   Curing Temp  Resistive  Characteristics
  CSP - 3163        Ag 120°C~130°C/10min  10 Ω· ㎝ Low resistivity
  CSP - 3350      Ag/C 120°C~130°C/10min  10 Ω· ㎝ Carbon blended,low cost
  CSP - 3225         C 120°C~130°C/10min  10 Ω· ㎝ Excellent flexibility

 Main features

         ●Good printing characteristics
         ● High conductivity
         ● High surface hardness and wear resistance
         ● Excellent adhesion to polyester film
         ●Excellent flexibility
         ● fin line resolution
Applications
         ● Membrane touch switches
         ● Flexible circuits
         ● Printed antenna
         ● Heating element
         ● RFI shieldings

※ Conductivities  of Ag, Ag/C and carbon pastes can be
    adjustable upon request.

 

 ◆ Pastes for Silver Through-Holes

  Product No.     Composition Curing Temp    resistivity   Characteristics
  CSP - 4250   Ag  150°C/30min    10 Ω· ㎝   High reliability

Main features

        ● High conductivity
        ● Excellent adhesion to Cu plate and phenolic  board
        ● Excellent flow properties resulting in smooth and good shape
         of cured paste inside the hole
        ● High reliability
        ● No defects like pinholes and cracks
Applications
        ● Double sided printed circuit boards (phenolic PCB)

 

 ◆ Pastes for Slide Volumes

 Product No.   Composition   Curing Temp   resistivity   Characteristics
  CSP - 4250         Ag  150°C/30min   10 Ω· ㎝  High abrasion   resistance

Main features

        ● High conductivity
        ● High abrasion resistance
        ●Good printability
Applications
      ● Slide volumes (phenolic substrate)



◆ Pastes for PTC Thermistors

Product No. Composition Firing Temp Characteristics
CSP - 0375        Ag  500~600°C/10min Cover paste (2nd electrode)
CSP - 0450      Ag/Zn  500~600°C/10min Ohmic paste (1st electrode)

Main features

        ● Excellent adhesion to PTC ceramics  (CSP-0450)
        ●Low variation of  resistance after firing (CSP-0450)
        ● CSP-0450(Ohmic paste) can be used with or without  CSP_0375
        ● Low firing temperature
        ● High reliability
        ● Good printability
Applications
      ● PTC thermistor electrodes
※PTC : Positive temperature coefficient



◆ Pastes for NTC thermistors

  Product No.  Composition     Firing Temp Characteristics
  CSP - 0572        Ag   500~850 °C/10min Wide range of firing temperature

Main features

      ● Several time firings are possible, which can adjust  
          the resistance of thermistor
        ● Wide range of firing temperature
        ● very low resistance variation after firing, 
             soldering, aging and resin coating
        ● Good solderability
        ● Good solderability & excellent adhesion strength
Applications
      ● NTC thermistor electrodes
※NTC : Negative temperature coefficient

　

◆ Pastes for Varistors

  Product No.   Composition     Firing Temp

    Characteristics
  CSP- 0275      Ag  500~600°C/10min

Low firing temperature

Main features

        ● Low firing temperature
        ● Good adhesion
        ● Excellent printability
        ●Good solderability
        ● High surface hardness
Applications
      ●ZnO varistor electrodes

　

◆ Pastes for Piezo-Electric products

   Product No.   Composition  Firing Temp        Characteristics
  CSP - 0960B       Ag  650~850°C/10min    High solder resistance
  CSP - 0970A       Ag  650~850°C/10min        Excellent hardness
  CSP - 0970B       Ag  650~850°C/10min   Excellent contact properties
  CSP - 0969       Ag  650~850°C/10min Good frequency characteristics

Main features
        ● Piezo buzzer(CSP-0960B)
         -Excellent solderablility
         -Strong adhesion to piezo ceramcis
        ● Resonator (CSP_0970A, 0970B)
         -Excellent hardness
         -Controlled rheological properties
        ● lgnition element (CSP-0969B)
         -High surface hardness
         -Good frequency characteristics

　

◆ Pastes for Microwave Products

   Product No.    Composition      Firing Temp    Characteristics
   CSP - 1365D           Ag  700~850°C/10min      Dipping type
   CSP - 1365p           Ag  700~850°C/10min      Printing type
   CSP - 1365s           Ag  700~850°C/10min      Spray type

Main features
        ●  High quality factor
        ●  High solder resistance
        ●  Excellent adhesion strength
Applications
        ● Dielectric resonator
        ●Dielectric ceramic filter
        ●Dielectric patch antenna

　

◆ Pastes for Ceramic Disc Capacitors

    Product No.  Composition      Firing Temp          Characteristics
    CSP - 0155        Ag  750~850°C/10min

General purpose

    CSP - 0165        Ag  750~850°C/10min

High voltage

    CSP - 0185        Ag  750~850°C/10min

Special purpose


Main features

         ● Excellent adhesion to ceramic capacitor
         ● Excellent solderability
         ● High quality factor
         ●Good printability
 Applications
         ●Ceramic disc capacitor electrode
 ※Custom specifications of silver contents are available upon request.

　

◆ Pastes for Hybrid ICs

 Product No.  Composition Firing Temp Characteristics

CSP - 1282

Ag/Pd 850°C/10min Excellent solderability

 CSP - 1275G

Glass 510°C/10min Excellent hardness

Main features
        ● Fine line resolution
        ● High conductivity (CSP - 1282)
        ● Excellent printability
        ● Excellent adhesion strenghth to AI O substrate
Applications
        ●HICs (hybrid integrated circuit)
※Any ratios of Ag/ Pd are also available

　

  What is conductive paste?   

The Paste are dispersions of metal powders or inorganic oxides in organic fluid vehicle systems.  
These compositions con be described as having three part; functional phase, binder and vehicle .
The functional phase can be metal, glass and/or ceramic powders. the binder (glass frits or resin)
serves to adhere the finished film to its substrates. The vehicle is made up of resins and solvents.
Therefore, the success of paste processing is dependent to a great extent upon the understanding
and evaluating of the physical and chemical properties(apparent, tapping), particle size and size
distribution, particle shape and surface area, etc.

　

  Inspection Parameters  

1. Viscosity

2. Thixotropic Index(T1)

3. Fineness of Grind(FOG)

4. Specific Gravity

5. Resistivity 

6. Adhesion Strength

7. Reliability test

1.viscosity
Viscosity is the most widely used parameter for assessing a paste's flow
behavior. It is the internal resistance exerted by a fluid to the relative motion
of it's parts and is expressed in units of pascal second (Pa. sec). It is
defined as shear stress divided by shear rate, where shear stress is the force
in pascals applied to a viscous fluid to cause its movement, and shear rate, in reciprocal seconds, is the rate of travel of two parallel plates separated by
a fluid, divided by the distance between the plates(Cm/sec. Cm =sec .It can
be expressed as follows;
One pascal second is equal to ten poise
* Viscometer  Brookfield HBDV - Ⅱ+
                      RION VT-04
* Standard : JIS K 7117


2. Thixotropic Index (T1)
Thixotropic Index is a measure of thixotropic property of the non-Newtonian fluid. A common method characterizing and quantifying TI is to figure the ratio of the fluid's viscosity as measured at two different speeds(with the same spindle). These measurements are usually made at speeds that differ by a factor of 10 (for example, 10 and 100rpm). TI can be expressed as below;
TI of the paste must be optimized because the rheological behavior of the paste have a profound effect on the quality of screen printing.
* Viscometer : Brookfield HBDV-Ⅱ+
** Standard : ASTM D 2196-86


3.Fineness of Grind(FOG)
FOG gives a useful idea of the number and size of undispersed particles of the paste. The guage consists of a hardened steel block into which a wedge- shaped groove has been cut. The groove , which may be 25 ㎛ deep at one end, tapers uniformly along its length to zero depth at the other end. In practice, a sample of the paste is placed at the deep end of the groove and draw down with a scraper. Read the depth of the third scratch from the deep end the size that fifth of area is scratched.
* Grindometer : Precision gage & tools.
** Standard : ASTM D 1210
4.Specific Gravity
The specific gravity is determined by weighting a defined volume of a paste. It effects on the amount of deposition of paste on the substrate after printing.
* Pycnometer : Fisher scientific company
** Standard : ASTM D 1475-16
5.Resistivity
The resistivity  of the conductive film is usually expressed as sheet resistivity, which is the resistance of the unit area at a given thickness.
Resistivity(R) is calculated from the following equation.
Sheet resistivity(R's) is obtained by dividing R with L/W. The standard resistivity(Rs) is defined as the resistivity of a standard film thickness. The standard resistivity of 15㎛ film thickness is shown below.
6.Adhesion Strength
1) Curing Type Pastes
The cross cut & peeling test is a simple and easily practicable method for evaluating the adhesion of cured film to the substrate. Cross hatch cuter has eleven cutting edges with the space of one mm. Using this tool, we can make 100pieces of 1X1 mm pad on the cured film.
After cutting, stick the scotch tape to the cut film and peel the tape. The ratio of the coated films remained on the adhesion strength.
* Cross hatch cutter : sheen 750
** ASTM D 3002, ASTM D 3359

2) Firing Type Pastes
A tin coated copper wire is soldered to the film. Then suing the push pull gauge, pull copper wire from the film. Read the gauge when the soldered area is failed.
* push pull gauge : IMADA FD-20K

7.Reliability test
In general the reliablity tests of conductive paste products are made under the circumstances of high/low temperatures, high humidity, cyclic temperature change, thermal shock, etc.
* Constant temperature and humidity chamber
   : DAEJIN DJ-THI
** Standards
   : JIS D 0202-1988, JIS D 0203, JIS K 5664-1983